Thermal Grizzly Duronaut is a thermal paste designed to improve heat transfer in electronic devices, such as processors and graphics cards. It helps lower component temperatures and enhances cooling efficiency.

The paste is suitable for use in processors (CPU), graphics cards (GPU), laptops, and integrated circuits (IC).

Features

  • High thermal conductivity
  • Excellent long-term stability
  • Silicone-based composition with aluminum powder and zinc oxide nanoparticles
  • Minimizes pump-out effect
  • Very thin application layer that reduces thermal resistance
  • Electrically insulating
  • No curing required

Package contents

  • 2 g thermal paste
  • Spatula for application

Additional information

Color

Grey

Country of Origin

Germany

PID

1059016

Product depth (mm)

100

Product height (mm)

15

Product volume (l)

300

Product weight (g)

5

Product width (mm)

200

Manufacturer address

Gewerbestraße 39, D-16540 Hohen Neuendorf, Germany

Manufacturer's email address

sales@thermal-grizzly.com

Manufacturer name

Thermal Grizzly Holding GmbH

Warnings

Undvik kontakt med ögon och hud. Vid kontakt med ögon: skölj försiktigt med vatten i flera minuter, ta ut ev. linser och fortsätt skölja; sök vård vid kvarstående irritation. Vid förtäring: skölj munnen, framkalla inte kräkning; kontakta läkare. Förvaras oåtkomligt för barn. Endast för avsett ändamål. Släpp inte ut i avlopp eller vattendrag.

Toote pildid on illustratiivsed ja näitlikud. Originaaltoote omadused võivad nende tegelikust väljanägemisest erineda, seega palun tutvuge tootekirjelduses toodud tootespetsifikatsioonidega.
LAOS OLEMAS

Thermal Grizzly Duronaut thermal paste, 2 g

16.11
sis. KM 24%
  • Korkea lämmönjohtavuus ja pitkäkestoinen stabiilisuus
  • Sähköisesti eristävä ja ohut levityskerros
  • Minimoi pump-out-ilmiön tehokkaasti
  • Silikonipohjainen koostumus nanohiukkasilla
Eeldatav tarneaeg: 4-7 päeva
Maksa hiljem või osana
Tootekood: TG-D-002-R
EAN kood: 4260711991134, 2220010590164

Thermal Grizzly Duronaut is a thermal paste designed to improve heat transfer in electronic devices, such as processors and graphics cards. It helps lower component temperatures and enhances cooling efficiency.

The paste is suitable for use in processors (CPU), graphics cards (GPU), laptops, and integrated circuits (IC).

Features

  • High thermal conductivity
  • Excellent long-term stability
  • Silicone-based composition with aluminum powder and zinc oxide nanoparticles
  • Minimizes pump-out effect
  • Very thin application layer that reduces thermal resistance
  • Electrically insulating
  • No curing required

Package contents

  • 2 g thermal paste
  • Spatula for application

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