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| Country of Origin | China |
|---|---|
| PID | 1026476 |
| Product depth (mm) | 20 |
| Product height (mm) | 1 |
| Product weight (g) | 53 |
| Product width (mm) | 120 |
| Manufacturer address | Bevenroder Straße 149, 38108 Braunschweig, Germany |
| Manufacturer's email address | |
| Manufacturer name | Arctic Cooling |
ARCTIC TP-3 thermal pads are soft and high-performance thermal interface materials suitable in various thicknesses for cooling a wide range of electronic components. The TP3 series offers options for different mounting needs, and the thermal pads work excellently, for example, in RAM modules, chipsets, IC components, graphics cards, and game consoles. The silicone-based material combined with a special filler provides efficient thermal conductivity along with a soft structure that fills even small unevenness.
The softness of the TP-3 thermal pads allows for leveling height differences between components. They maintain their thermal conductivity even when compressed and are well suited for tight or uneven structures. Thermal pads can be used individually or stacked on top of each other if needed without performance degradation.
The series’ thermal pads are electrically insulating and vibration-damping, which increases component safety. They are suitable for use in desktop computers, laptops, graphics cards, and other devices where transferring heat away from hot parts is important.
TP-3 thermal pads are not self-adhesive, making them neat and safe to handle. They can be precisely cut to the desired size, making them a flexible solution for various cooling solutions and device assemblies.
12 in stock
ARCTIC TP-3 thermal pads are soft and high-performance thermal interface materials suitable in various thicknesses for cooling a wide range of electronic components. The TP3 series offers options for different mounting needs, and the thermal pads work excellently, for example, in RAM modules, chipsets, IC components, graphics cards, and game consoles. The silicone-based material combined with a special filler provides efficient thermal conductivity along with a soft structure that fills even small unevenness.
The softness of the TP-3 thermal pads allows for leveling height differences between components. They maintain their thermal conductivity even when compressed and are well suited for tight or uneven structures. Thermal pads can be used individually or stacked on top of each other if needed without performance degradation.
The series’ thermal pads are electrically insulating and vibration-damping, which increases component safety. They are suitable for use in desktop computers, laptops, graphics cards, and other devices where transferring heat away from hot parts is important.
TP-3 thermal pads are not self-adhesive, making them neat and safe to handle. They can be precisely cut to the desired size, making them a flexible solution for various cooling solutions and device assemblies.