[woo_category_tree]
| Country of Origin | China |
|---|---|
| PID | 1026464 |
| Product depth (mm) | 100 |
| Product height (mm) | 2 |
| Product weight (g) | 47 |
| Product width (mm) | 100 |
| Manufacturer address | Bevenroder Straße 149, 38108 Braunschweig, Germany |
| Manufacturer's email address | |
| Manufacturer name | Arctic Cooling |
ARCTIC TP-3 thermal pads are soft and high-performance thermal interface materials suitable in various thicknesses for cooling a wide range of electronic components. The TP3 series offers options for different installation needs, and the thermal pads work excellently, for example, in RAM modules, chipsets, IC components, graphics cards, and gaming consoles. The silicone-based material combined with a special filler provides efficient thermal conductivity and a soft structure that fills even small irregularities.
The softness of the TP-3 thermal pads allows for leveling height differences between components. They maintain their thermal conductivity even when compressed and are well suited for tight or uneven structures. Thermal pads can be used individually or stacked on top of each other without performance loss.
The series’ thermal pads are electrically insulating and vibration dampening, increasing component safety. They are suitable for use in desktop computers, laptops, graphics cards, and other devices where heat transfer from hot parts is important.
TP-3 thermal pads are not self-adhesive, making them neat and safe to handle. They can be precisely cut to the desired size, making them a flexible solution for various cooling solutions and device configurations.
18 in stock
ARCTIC TP-3 thermal pads are soft and high-performance thermal interface materials suitable in various thicknesses for cooling a wide range of electronic components. The TP3 series offers options for different installation needs, and the thermal pads work excellently, for example, in RAM modules, chipsets, IC components, graphics cards, and gaming consoles. The silicone-based material combined with a special filler provides efficient thermal conductivity and a soft structure that fills even small irregularities.
The softness of the TP-3 thermal pads allows for leveling height differences between components. They maintain their thermal conductivity even when compressed and are well suited for tight or uneven structures. Thermal pads can be used individually or stacked on top of each other without performance loss.
The series’ thermal pads are electrically insulating and vibration dampening, increasing component safety. They are suitable for use in desktop computers, laptops, graphics cards, and other devices where heat transfer from hot parts is important.
TP-3 thermal pads are not self-adhesive, making them neat and safe to handle. They can be precisely cut to the desired size, making them a flexible solution for various cooling solutions and device configurations.