Thermal Grizzly Minus Pad Extreme V2 is a thermal pad designed to improve heat transfer in demanding applications. It acts as a heat-conductive layer between device components and cooling elements.

The product is intended for use in cooling systems of computers and other electronic devices where efficient thermal management is required. It is especially suitable for situations where reducing thermal resistance and improving component cooling is desired.

Features

  • Dimensions: 100 × 100 mm
  • Thickness: 2.0 mm
  • Material: aluminum oxide, aluminum hydroxide, and aluminum powder
  • Good thermal conductivity
  • Soft and malleable surface that fills surface irregularities
  • No curing required
  • Electrically insulating

Package contents

  • 1 pc thermal pad 100 × 100 × 2.0 mm

Additional information

Color

Grey

Country of Origin

Taiwan

PID

1059007

Product depth (mm)

100

Product height (mm)

2

Product volume (l)

20

Product weight (g)

79

Product width (mm)

100

Manufacturer address

Gewerbestraße 39, D-16540 Hohen Neuendorf, Germany

Manufacturer's email address

sales@thermal-grizzly.com

Manufacturer name

Thermal Grizzly Holding GmbH

Warnings

Inte klassificerad som farlig. Undvik kontakt med ögon och hud. Vid kontakt med ögon: skölj försiktigt med vatten i flera minuter. Förvaras oåtkomligt för barn.

Toote pildid on illustratiivsed ja näitlikud. Originaaltoote omadused võivad nende tegelikust väljanägemisest erineda, seega palun tutvuge tootekirjelduses toodud tootespetsifikatsioonidega.
LAOS OLEMAS

Thermal Grizzly Minus Pad Extreme V2 thermal pad, 100 x 100 x 2.0 mm

74.39
sis. KM 24%
  • Hyvä lämmönjohtavuus ja pehmeä pinta
  • Sähköisesti eristävä ja muotoutuva pinta
  • Ei vaadi kovettumista käyttövalmiina
  • Sopii epätasaisille pinnoille
Eeldatav tarneaeg: 4-7 päeva
Maksa hiljem või osana
Tootekood: TG-MP-E2-100-100-20
EAN kood: 4260711992186, 2220010590072

Thermal Grizzly Minus Pad Extreme V2 is a thermal pad designed to improve heat transfer in demanding applications. It acts as a heat-conductive layer between device components and cooling elements.

The product is intended for use in cooling systems of computers and other electronic devices where efficient thermal management is required. It is especially suitable for situations where reducing thermal resistance and improving component cooling is desired.

Features

  • Dimensions: 100 × 100 mm
  • Thickness: 2.0 mm
  • Material: aluminum oxide, aluminum hydroxide, and aluminum powder
  • Good thermal conductivity
  • Soft and malleable surface that fills surface irregularities
  • No curing required
  • Electrically insulating

Package contents

  • 1 pc thermal pad 100 × 100 × 2.0 mm

Sarnased tooted

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