Thermal Grizzly Minus Pad Extreme V2 is a thermal pad designed to efficiently transfer heat between components of electronic devices. It helps improve cooling by filling uneven surfaces and gaps, reducing thermal resistance.

This thermal pad is especially suitable for demanding applications requiring excellent heat transfer. It is compatible with processors, graphics cards, and other components that require thermally conductive material insulation and enhanced cooling.

Features

  • Dimensions: 100 × 100 mm, thickness 1.0 mm
  • Excellent thermal conductivity
  • Soft and moldable surface that adapts to unevenness
  • No curing required
  • Electrically insulating material
  • Material composition: aluminum oxide, aluminum hydroxide, and aluminum powder

Package contents

  • 1 thermal pad (100 × 100 × 1.0 mm)

Additional information

Color

Grey

Country of Origin

Taiwan

PID

1059001

Product depth (mm)

100

Product height (mm)

1

Product volume (l)

10

Product weight (g)

42

Product width (mm)

100

Manufacturer address

Gewerbestraße 39, D-16540 Hohen Neuendorf, Germany

Manufacturer's email address

sales@thermal-grizzly.com

Manufacturer name

Thermal Grizzly Holding GmbH

Warnings

Inte klassificerad som farlig. Undvik kontakt med ögon och hud. Vid kontakt med ögon: skölj försiktigt med vatten i flera minuter. Förvaras oåtkomligt för barn.

Toote pildid on illustratiivsed ja näitlikud. Originaaltoote omadused võivad nende tegelikust väljanägemisest erineda, seega palun tutvuge tootekirjelduses toodud tootespetsifikatsioonidega.
LAOS OLEMAS

Thermal Grizzly Minus Pad Extreme V2 thermal pad 100 x 100 x 1.0 mm

37.19
sis. KM 24%
  • Erinomainen lämmönjohtavuus ja pehmeä pinta
  • Sähköisesti eristävä lämpöalusta
  • Soveltuu vaativiin jäähdytystarpeisiin
  • Ei vaadi kovettumista tai lisäkäsittelyä
Eeldatav tarneaeg: 4-7 päeva
Maksa hiljem või osana
Tootekood: TG-MP-E2-100-100-10
EAN kood: 4260711992209, 2220010590010

Thermal Grizzly Minus Pad Extreme V2 is a thermal pad designed to efficiently transfer heat between components of electronic devices. It helps improve cooling by filling uneven surfaces and gaps, reducing thermal resistance.

This thermal pad is especially suitable for demanding applications requiring excellent heat transfer. It is compatible with processors, graphics cards, and other components that require thermally conductive material insulation and enhanced cooling.

Features

  • Dimensions: 100 × 100 mm, thickness 1.0 mm
  • Excellent thermal conductivity
  • Soft and moldable surface that adapts to unevenness
  • No curing required
  • Electrically insulating material
  • Material composition: aluminum oxide, aluminum hydroxide, and aluminum powder

Package contents

  • 1 thermal pad (100 × 100 × 1.0 mm)

Sarnased tooted

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